HIGHEST THROUGHPUT WITH THINNEST WIRE
The DW 291 is specifically designed for slicing mono- and multi- crystalline silicon bricks into wafers for the photovoltaic industry.
The new developed DW 291 sets industry standards for fastest wafer cutting times. The DW 291 delivers a comprehensive set of innovations to further increase wafer output.
Longer wire web length as well as higher wire speed and wire acceleration enable an increased throughput per machine and year. Usage of ultra-thin diamond wire is possible as a result of optimized inertia of moving parts, shorter wire path and the Diamond Wire Management System (DWMS).
DW 291 is highly resistent to temperature fluctuation and vibrations due to its compact and robust mineral cast frame and rigid design.
Operation is safer, easier and faster thanks to higher process automation and new intuitive HMI with dialog-based production assistant.
- Increased throughput
- Thin wire capability
- Robustness and durability
- Higher process automation
- Easy and safe operation
Diamond Wire Management System (DWMS)
The market-proven DWMS provides resharpening technology and extended winding feature and is patented in China (Patent No. CN 1044114334B). The DWMS enables faster cutting times, lower consumption of diamond wire and lower wire breakage rate.
Thin Wire Capability
The use of 40 µm thin diamond wire is proven in production. This extraordinary capability reduces significantly the kerf loss and maximizes the number of wafers per kilogram of silicon. Compact design and improved access to all relevant machine parts allow better handling of thin wires and boost operator efficiency.
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